Intel FI Discipline Engineer in Hillsboro, Oregon
The engineer will support and lead projects involving semiconductor fabrication facilities, support buildings, process equipment, and related systems. During these projects this individual will oversee technical design execution, scope creation, data collection, and budget estimation. In addition, the individual will act as a customer engineering representative for Intel. As a representative, this person will interface with a number of internal Intel organizations, equipment suppliers, architectural and engineering firms, and other entities to enable design and construction of Intel equipment and facilities. The individual will also be assigned to a specific process area (Lithography, Etch, Diffusion, etc.) to act as a single point of contact for new engineering and design activities in that area.
Additional responsibilities include but are not limited to:
Driving consistency in facility and equipment installation processes across Intel's factories.
Developing and overseeing execution of engineering processes on a global scale.
Working with equipment suppliers to drive optimal equipment design and minimize construction and utility usage.
Document and explain design and scope content to both technical and non-technical team members.
Interface with a multi-user customer base and manage workload of multiple projects of varying complexity at the same time.
The ideal candidate should exhibit the following behavioral traits:
Verbal, written, and presentation skills to convey technical information to a variety of personnel, both internal and external to Intel.
Interpersonal skills & capability to facilitate a teamwork environment.
This is an entry level position and will be compensated accordingly.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences
Candidate must possess a Master's degree in Electrical or Mechanical Engineering.
Minimum of 1 year of experience in facility/equipment design.
Minimum of 1 year of experience creating/executing engineering processes.
Passing score on Fundamentals of Engineering Exam.
Understanding of engineering methods and design principles to ensure analyzed content is both feasible and constructible.
Experience with 2D or 3D CAD design software (AutoCAD; Bentley MicroStation, Solidworks, Inventor,etc.)
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....
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