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Intel Packaging Research and Development Engineer in Hillsboro, Oregon

Job Description

Microelectronic Packaging Engineers in Assembly Test and Technology Development (ATTD) will be expected to:

  • Provide project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

  • Be responsible for the thermal and/or mechanical and/or electrical design, analysis, and development of electronic packages.

  • Define overall package performance and specification and realize technology certification through layout design and test vehicle design.

  • Conduct tests and research on basic materials and properties.

  • Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance.

  • Provide consultation concerning packaging problems and improvements in the packaging process.

  • Respond to customer's requests or events as they occur.

  • Develop solutions to problems utilizing formal education and judgment.

The candidate should also exhibit the following behavioral traits and/or skills and/or requirements (6+ months of experience with the following (having more than one will be preferred):

  • Experience in fundamental science and engineering concepts in development to create novel solutions

  • Technical innovation and deliver results for complex, time critical technical projects.

  • Technology with technical and analytical skills.

This is an entry level position and compensation will be given accordingly.

Qualifications

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Requirements

  • Possess a master's degree or PhD degree in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or related field and 6+ months of experience.

6+ months of experience with the following (having more than one will be preferred):

  • Engineering concepts in development to create novel solutions

  • Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

Preferred

6+ months of experience with the following:

  • Semiconductor fabrication processes

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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