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Intel Packaging Research and Development Engineer in Hillsboro, Oregon

Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging R&D Engineers provide project management package design and/or development and sustaining support for integrated circuit or semiconductor assemblies various other electronic components and/or completed units.

  • Responsible for the thermal and/or mechanical and/or electrical design analysis and development of electronic packages.

  • Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.

  • Conducts tests and research on basic materials and properties.

  • Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.

  • Provides consultation concerning packaging problems and improvements in the packaging process.

  • Responds to customer and/or client requests or events as they occur.

  • Develops solutions to problems utilizing formal education and judgment.

The candidate should also exhibit the following behavioral traits and/or skills:

  • ​Technical innovation and deliver results for complex time critical technical projects

  • Technology with technical and analytical skills

  • Problem solving and technical innovation to resolve complex challenges

  • Understanding of semiconductor fabrication processes

  • Analytical skills

  • Process development

This is an entry level position and compensation will be given accordingly.

Qualifications

You must possess the below requirements to be initially considered for this position

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates

Experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences

Requirements

  • Possess a masters degree with 6+ months of relevant experience or PhD degree with 1+ years of relevant experience in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry or Optical Engineering or Polymer Science and Engineering or related field

Preferred

6+ months of experience in:

  • Prior clean room and/or manufacturing

  • Statistics

  • FMEA

  • Mechanics of materials

  • Project management

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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