Intel SoC Design Engineer - Power Delivery Designer in Hillsboro, Oregon
Come join Intel’s Client Engineering Group, responsible for designing Client SOCs that make up more than half of Intel’s annual revenue. We envision the future of computing and design for the next generation of laptop and desktop computers.
We are looking for a Senior SoC (System on Chip) Design Engineer - Power Delivery Designer ready to research, design, develop, and test lead Intel designs as we reimagine how to build SOCs at Intel and in the semiconductor industry. This is a role within Intel’s highly-regarded Devices Development Group, headquartered in Portland, Oregon with additional sites in Austin, Texas, and Penang, Malaysia. Our bold purpose as a company is to “create world-changing technology that enriches the lives of every person on earth” and this role is instrumental in furthering our mission to shape the future of technology.
In this role your responsibilities may include, but not be limited to:
Full Chip Power Grid Design and Simulation (ICC2 and Redhawk)
ESD configuration (electro-static discharge)
Silicon bump design planning and optimization
Complicated wire/bus planning, analysis, and simulations (Redhawk)
Power grid reliability and IR-Drop analysis
Exploring and developing flows and methodologies for die-stacking (3D-IC design)
Cooperation with design implementation team on power grid integrity validation
In addition to the qualifications listed below, the ideal candidate will also demonstrate the following traits:
Self-motivator with strong problem-solving skills
Strong leadership skills with willingness to mentor junior designers
Excellent interpersonal skills, including written and verbal communication
Willingness to work as part of a team and collaborate in a high-paced atmosphere, including support for customers in the ASIC physical design team
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must have a Bachelor’s degree in Electrical/Computer Engineering and 6+ years of experience in: - OR – a Master’s degree in electrical/Computer Engineering and 4+ years of experience in:
Design principles and techniques in SoC and/or VLSI back-end design and/or integration
Proven experience in on-die power delivery design including FC layout specs and implementation
3+ years of experience with:
Analog Circuit design principles and techniques
Solid TCL and/or Python scripting skills
Proven record of successful chip tapeouts
Inside this Business Group
The Silicon Engineering Group is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs that power Intel’s leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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