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Siemens Applications Engineer - IC Packaging - MG - SISW - 206731 in Wilsonville, Oregon

Company: SISW - Mentor

Job Title: Applications Engineer – IC Packaging – MG – SISW - 206731

Job Location: Wilsonville, OR

Job Category: Applications Engineering

During the current global health crisis, the priority for Siemens Digital Industries Software is the health and well-being of our entire community including current and future employees, which may add time to our hiring processes. We appreciate your patience and invite you to visit our website at https://www.sw.siemens.com/page/covid-19 to learn more about how Siemens is responding to the pandemic.

As an Applications engineer with Mentor Graphics’ Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers. Your primary responsibility is to secure technical design wins for Mentor Graphics' product and service offerings. Specifically, you will be responsible for technical wins with the industry leading Xpedition Substrate Integrator and Xpedition Package Designer product families.

Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of account strategies leading to market share gains for Mentor Graphics. Your territory coverage consists of Key Accounts located, but not limited to, the Western United States (primarily Silicon Valley, Oregon, and Washington with additional opportunities in Southern California and Arizona). While your accounts will primarily in the Pacific Northwest and Silicon Valley, you will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders. International travel is likely.

Qualifications:

  • MSEE/BSEE with 2+ years design experience.Significant experience in IC Packaging design processes with a focus on highspeed verification is required. Specifically, you should have demonstratedexperience in the areas of Package and/or PCB design, fabrication, andverification. Additional experience with Signal Integrity Analysis and/or Valoris also desirable. The ability to develop scripts to enhance Mentor’s productofferings is highly desired. Necessary technical skills include:

  • Prior experience with Mentor’s Xpedition flowis preferred.

  • Prior experience with CadenceAllegro/APD/SiP/Orbit IO or Zuken CR-5000/8000 is a plus.

  • Prior experience as an Applications Engineer ispreferred.

  • Additional experience with IC P&R toolsparticularly for Silicon Interposer design is a plus.

  • Experience with Mentor’s Calibre DRC, LVS,and/or 3DSTACK solutions is also desirable.

  • Above average competency with Microsoft Word,Excel, and PowerPoint.

  • Scripting/Programming: Python, Tcl, VBScript,VB.net, C#, or similar languages.

  • Working OS knowledge of Windows and Linux.

  • Familiarity with Package Design process ishighly desired.

  • The ideal candidate will:

  • Possess a passion to learn and perform at thecutting edge of technology;

  • Have a desire to broadenexposure to thebusiness aspects of the technical design world;

  • Enjoy contributing to the success of a greatteam;

  • Effectively influence people at any level;

  • Enjoy helping and motivating others to besuccessful.

  • Demonstrated ability to build strong rapportand credibility with customer organizations while maintaining a company internalnetwork of contacts.

  • Have the capability to work independently withminimal direction and supervision.

  • Be willing to travel domestically andinternationally. Minimum Qualifications:

  • Two years of system design experience, BSEE /BSCE desired.

  • Previous experience as an applications engineeris a plus.

  • Excellent written and verbal communicationsskills in English are essential.

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Organization: Digital Industries

Company: Mentor Graphics Corporation

Experience Level: Experienced Professional

Job Type: Full-time

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